单芯片集成的趋势使得手持设备变的小巧而可靠，并具备了多种功能。现在的驱动器的尺寸已经小于1mm3，但仍然能提供高质量、无明显干扰的输出信号。除了半导体制造技术的进步之外，小尺寸的芯片和表面贴装芯片的流行也意味着更多的高科技元件能做成的体积。表面贴装芯片比过孔式模型有更多的优势，比如能用取放机器进行简单的自动组装，在节省空间的双面电路板设计方面提供更多的灵活性。采用较少的元件是另一个节省空间和能量的趋势，它能使便携设备在变小的同时延长了电池寿命。
PV023R1K1T1NHCC
PV023R1K1T1VMMC
PV023R1K1T1WMRC
PV023R9K1T1NFWS
PV023R1K1JHNMMC
PV023R1K4T1NFHS
PV023R1L1T1NMMC
PV023R1K8T1VMMC
PV023R1K1T1NFRZ
PV023R9K1T1NMMC
PV023R1K4T1NMR1
PV023R1K1T1VFDS
PV023R1K8T1NMMC
PV023R1K8T1NFWS
PV023R1K1T1WMR1
PV023R1K8T1N001
PV023L1K1T1NMMC
PV023R1K4T1NMMC
PV023R1K1T1NKLC
PV023R1K4T1NFR1
PV023R1K1S1NFWS
PV023R1K1T1NFFC
PV023L1K1T1NFWS
PV023R1K1T1WFDS
PV023R1K1T1NFFP
PV023R1L1T1NF
PV023R1K1T1WMM1
PV023R1K1T1NHLC
PV023R1K1T1NMRZ
PV023R1K1T1NMRK
PV023R1K1T1WMMC
PV023R1K1T1NFF1
PV028R1K1T1N001
PV028R1K1T1N100
PV028R1K1T1NFDS
PV028R1K1T1NFR1
PV028R1K1T1NFHS
PV028R1K1T1NMMC
PV028R1K1T1NMM1
PV028R1K1T1NMRC
PV028R1K1T1NFWS
PV028R1K1T1NFRC
PV028R1K1T1NFF1
PV028R1K1T1WMM1
PV028R1K1T1WFR1
PV028R1K8T1NFWS
PV028R1K4T1NFR1
PV028R1K1T1VMMC
PV028R1K1T1NHCC
PV028R1K4T1NMMC
PV028R1K1T1NELC
PV028R1K1T1NHLC
PV028R1K8T1N001
PV028R1K1T1NF
PV028R9K1T1NFWS
PV028R9K1T1NMMC
PV028R1K1T1VFDS
PV028R1K1AYNMRZ
PV028R1K8T1NMMC
PV028R1K1T1NMRK
PV028R1K1T1NFFP
PV028L1K1T1NMMC
PV028R1K1T1NFRZ
PV028R1K1S1NFWS
PV028R1K1T1NMMZ
PV028R1K1T1NMR1
PV028R1K1T1NMFC
PV028R1K1T1WFDS
PV028L1K1T1NFWS
PV028R1K1JHNMMC
PV028R1K1T1NMRZ
PV028R1K4T1NFHS
PV028R1K1T1NMF1
PV028R1K1T1NGLC
PV028R1K1T1WMRC
PV028R1L1T1NMMC
PV028R1K1T1WMMC
PV028R1K1T1WMR1
PV028R1K8T1VMMC
PV028R1K1T1NFFC
PV028R1K1T1NMMK
PV028R1K4T1NMR1
PV032R1K1T1N001
PV032R1K1T1N100
PV032R1K1T1NFDS
PV032R1K1T1NFR1
PV032R1K1T1NFHS
PV032R1K1T1NMMC
PV032R1K1T1NMM1
PV032R1K1T1NMRC
PV032R1K1T1NFWS
PV032R1K1T1NFRC
PV032R1K1T1NFF1
PV032R1K1AYNMTZ
PV032R1K1T1NMFC
PV032R1K1T1NMR1
PV032R1K1T1NMF1
PV032R1K1T1NMRK
PV032R1K1T1NFFP
PV032R1K1T1WMMC
PV032R1K4T1NMMC
PV032R1K8T1VMMC
PV032R1K1T1WFR1
PV032R1K1T1NFFC
PV032R1K1JHNMMC
PV032R1K1T1WMRC
PV032R9K1T1NFWS
5G技术的新特性对承载网络提出诸多挑战性的需求，本文在结5G承载网络架构变化的基础上，对5G前传、中传和回传网络可能的技术解决方案进行了分析，并介绍了5G传送技术标准化现状和发展方向。5G承载架构的变化相对于4GLTE接入网的BBU和RRU两级构架，5GRAN将演进为CU、DU和AAU3级结构，相应的承载网架构可以分解为前传、中传和回传网络。5G无线网、核心网均会朝着云化和数据中心化的方向演进。CU可以部署在核心层或骨干汇聚层，用户面为了满足低时延等业务的体验则会逐步云化下移并实现灵活部署，为了实现4G/5G/Wi-Fi等多种无线接入的协同，的控制面也会云化集中，之间的协同流量也会逐渐增多。
