电容式液位变送器核心部件采用*的射频电容电路经过16位单片机经过准确的温度补偿和线性修正，转化成标准电信号(一般为4~2mA)。可选HART、CANBUS、485通讯协议进行系统组态。全系列变送器都具有自校准功能，用户可通过两个按键进行“零点”、“量程”自动校准，以适应各种复杂场所的不同要求。特点是结构简单，无可动或弹性元部件，因此可靠性极高，维护量极少。一般情况下,不必进行常规的大、中、小维修；多种信号输出，方便不同系统配置；适用于高温高压容器的液位测量，且测量值不受被测液体的温度、比重及容器的形状、压力影响；特别适用于酸、碱等强腐蚀性液体的测量；完善的过流、过压、电源极性保护。
PV023R1K1T1NHCC
PV023R1K1T1VMMC
PV023R1K1T1WMRC
PV023R9K1T1NFWS
PV023R1K1JHNMMC
PV023R1K4T1NFHS
PV023R1L1T1NMMC
PV023R1K8T1VMMC
PV023R1K1T1NFRZ
PV023R9K1T1NMMC
PV023R1K4T1NMR1
PV023R1K1T1VFDS
PV023R1K8T1NMMC
PV023R1K8T1NFWS
PV023R1K1T1WMR1
PV023R1K8T1N001
PV023L1K1T1NMMC
PV023R1K4T1NMMC
PV023R1K1T1NKLC
PV023R1K4T1NFR1
PV023R1K1S1NFWS
PV023R1K1T1NFFC
PV023L1K1T1NFWS
PV023R1K1T1WFDS
PV023R1K1T1NFFP
PV023R1L1T1NF
PV023R1K1T1WMM1
PV023R1K1T1NHLC
PV023R1K1T1NMRZ
PV023R1K1T1NMRK
PV023R1K1T1WMMC
PV023R1K1T1NFF1
PV028R1K1T1N001
PV028R1K1T1N100
PV028R1K1T1NFDS
PV028R1K1T1NFR1
PV028R1K1T1NFHS
PV028R1K1T1NMMC
PV028R1K1T1NMM1
PV028R1K1T1NMRC
PV028R1K1T1NFWS
PV028R1K1T1NFRC
PV028R1K1T1NFF1
PV028R1K1T1WMM1
PV028R1K1T1WFR1
PV028R1K8T1NFWS
PV028R1K4T1NFR1
PV028R1K1T1VMMC
PV028R1K1T1NHCC
PV028R1K4T1NMMC
PV028R1K1T1NELC
PV028R1K1T1NHLC
PV028R1K8T1N001
PV028R1K1T1NF
PV028R9K1T1NFWS
PV028R9K1T1NMMC
PV028R1K1T1VFDS
PV028R1K1AYNMRZ
PV028R1K8T1NMMC
PV028R1K1T1NMRK
PV028R1K1T1NFFP
PV028L1K1T1NMMC
PV028R1K1T1NFRZ
PV028R1K1S1NFWS
PV028R1K1T1NMMZ
PV028R1K1T1NMR1
PV028R1K1T1NMFC
PV028R1K1T1WFDS
PV028L1K1T1NFWS
PV028R1K1JHNMMC
PV028R1K1T1NMRZ
PV028R1K4T1NFHS
PV028R1K1T1NMF1
PV028R1K1T1NGLC
PV028R1K1T1WMRC
PV028R1L1T1NMMC
PV028R1K1T1WMMC
PV028R1K1T1WMR1
PV028R1K8T1VMMC
PV028R1K1T1NFFC
PV028R1K1T1NMMK
PV028R1K4T1NMR1
PV032R1K1T1N001
PV032R1K1T1N100
PV032R1K1T1NFDS
PV032R1K1T1NFR1
PV032R1K1T1NFHS
PV032R1K1T1NMMC
PV032R1K1T1NMM1
PV032R1K1T1NMRC
PV032R1K1T1NFWS
PV032R1K1T1NFRC
PV032R1K1T1NFF1
PV032R1K1AYNMTZ
PV032R1K1T1NMFC
PV032R1K1T1NMR1
PV032R1K1T1NMF1
PV032R1K1T1NMRK
PV032R1K1T1NFFP
PV032R1K1T1WMMC
PV032R1K4T1NMMC
PV032R1K8T1VMMC
PV032R1K1T1WFR1
PV032R1K1T1NFFC
PV032R1K1JHNMMC
PV032R1K1T1WMRC
PV032R9K1T1NFWS
印刷电路板（PCB）是集成各种电子元器件的信息载体，在电子领域中有着广泛的应用，其质量直接影响到产品的性能。在PCB制造过程中，PCB上的元器件安装普遍采用表面贴片安装技术。随着电子科技技术的发展和电子制造业的发展，电子产品趋于更轻、更小、更薄化。PCB板作为现代电子设备的重要组成部分，由于贴片元器件体积小，安装密度大，这就要求PCB板的集成度进一步提高。为了保证电子产品的性能，PCB板缺陷检测技术已经成为电子行业中非常关键的技术。
