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Sawatec
Leaflet_SMD-200 显影机:
外露光刻胶的研制是光刻胶研制过程中*关键的步骤，因此对研制过程及其参数(温度、研制时间等)的选择要特别注意。在喷淋显影过程中，对每个基板分别进行单独显影，并在暴露区域连续喷淋新显影剂或蚀刻剂，以防止显影剂饱和。
SAWATEC开发人员可用于水坑或喷雾开发，在此过程中，根据应用程序的技术和经济标准选择*流程。与水坑开发相比，喷雾开发的优点是可以释放非常小的精细结构。水坑法的优点是，当衬底有较深的结构时，显着较少的显影液需要和较好的结果。
SMD系列用于清洗和显影8英寸(200mm)以下的晶圆或6英寸(150x150mm)以下的基板。过程——室工作Ø212毫米。
由SAWATEC公司开发的SMD具有良好的工艺性能、低的化学消耗和可靠的重复性，甚至具有较厚的光刻胶层。由于操作简便，易于清洗，这些仪器是理想的适合于实验室，研发，研究所和试点项目。
该仪器可作为台式或移动式机柜。
功能(基本配置)
FEATURES
(BASIC CONFIGURATION)
§ Up to 50
programmes with 24 segments each can be programmed
§ Quick start
function for repeat processes
§ User-friendly
process configuration with touch screen panel
§ Process
parameter: speed, acceleration, process time, speed of the spray arm, developing
spray time
§ Electrical
driven spray arm, with dynamic or static function
§ Developer line
and media tank (2 litre) for one developer included
§ Nozzle for
DI-water-rinse and N2 drying on the spray arm
§ Nozzles in the
process bowl for the backside rinse
§ Control
elements for dosing of the compressed air and vacuum
§ Rotational
direction can be selected (CW, CCW)
§ Manual loading
and unloading of the substrates
Mechanical
substrate fixation
§ Acoustic
signal when the process has finished
PERFORMANCE
DATA
§ Speed
range: 0 to 3’000rpm +/-1rpm 1)
§ Speed
acceleration: 0 to 3’000rpm in 0.3 seconds 1)
§ Process
time up to 2376 seconds
§ Developer
spray time 99 seconds/segment
§ Speed of the
spray arm 10 to 200mm/seconds
§ Rinse
and N2 drying 99 seconds/segment
§ Heatable
process hood up to 50°C
§ Spray
nozzle made of PEEK 0,8mm
ADDITIONAL
FUNCTIONS (OPTIONS)
§ Additional
developer lines (up to 4 developer lines possible)
§ Start/stop
foot switch for ease of operation (cable length 1.8m)
§ Separation
unit for media exhaust (tank and laboratory equipment)
§ Developer
tank heating system (2 litre)
§ Spray nozzle
made of PEEK (0,3 / 0,5mm)
§ Nozzle for
puddle developing
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