兼具高精度与能量回收之特色，落实绿色制造Chroma170116V/100A测试系统具备能量再生功能，能够回收直流能量(DC-DC)，一旦直流能量溢出，系统将其转换回交流电网，是一个低发热、率运用的测试系统。Chroma17011产品具有多电流量程提高电流精度，电流量测精度达到±0.05%ofF.S.，电压精度达到±(0.02%ofRdg.+0.02%ofF.S.)，每个通道独立控制且具备热管理机制保障量测稳定性，快速电流响应可模拟脉冲或各种车况模拟，其采样速度*快可达10mS，同时可整合气候温箱进行测试控制，安全性方面设计有多层保护功能，检测提前发现异常避免实验风险。
PV032R1K1T1NGLC
PV032R1K4T1NFHS
PV032R1K8S1NFWS
PV032R1K8T1NMMC
PV032R1K1T1WFDS
PV032R1K1AYNMTP
PV032R1K1T1NHCC
PV032R1K1T1WMM1
PV032R1K1AYNMRZ
PV032R1K8T1NFWS
PV032R1K1A4NFTZ
PV032R1K1T1VMMC
PV032R1K1T1NFPV
PV032R1K1A1VFDS
PV032L1E3C1NFWS
PV032R1K1T1NELB
PV032L1K1T1NFWS
PV032R1K1B1NFDS
PV032RAK1T1NF
PV032R1L1B1NFWS
PV032R1K1T1NFPG
PV032R1K1S1NFWS
PV032L1K1T1NMMC
PV032R1K1T1NMRZ
PV032R1K1T1VFDS
PV032R1K1T1N10045
PV032R1K1AYNMT1
PV032R1K8T1N001
PV032R1K1T1NHLC
PV032R1K4T1NFR1
PV032R9K1T1NMMC
PV032R1K1A4VFRZ
PV032R1K1T1NFRZ
PV032R1K1T1NMMK
PV032R1L1T1NMMC
PV032R1K4T1NMR1
PV032R1K1T1WMR1
PV032R9K1T1NMMCK
PV032R1K1T1NE1B
PV032R1K1T1NKLC
PV040R1K8T1NMMC
PV040L1K1T1NFWS
PV040R1K1T1NFRC
PV040R1K1T1NFFP
PV040R1K4T1NMR1
PV040R1K1T1NMR1
PV040R1K1T1NFR1
PV040R1K4T1NMMC
PV040R1K1T1NFDS
PV040R1K1T1NFF1
PV040R1K1T1NMRZ
PV040R1K1AYNMRZ
PV040R1K4T1NFHS
PV040R1K1T1WFDS
PV040R1K8T1VMMC
PV040R1K8T1N001
PV040R9K1T1NMMC
PV040R1K4T1NFR1
PV040R1K1T1N001
PV040R1K8T1NFWS
PV040R1K1T1VFDS
PV040R1K1A4NFRZ
PV040R1K1T1NMRC
PV040R1K1T1NMM1
PV040R1K1T1WMM1
PV040R1K1T1NMRK
PV040R1K1T1NHCC
PV040R1K1T1NMF1
PV040R1K1JHNMMC
PV040L1K1T1NMMC
PV040R1K1S1NFWS
PV040R1L1T1NMMC
PV040R1D8T1N001
PV040R1K1T1NMFC
CSP(ChipScalePACkage)：芯片级封装，该方式相比BGA同等空间下可以将存储容量提升三倍，是由日本三菱公司提出来的。DIP(DualIn-linePACkage)：双列直插式封装，插装型封装，指采用双列直插形式封装的集成电路芯片，体积比较大。MCM(MultiChipModel)：多芯片模块封装，可根据基板材料分为MCM-L，MCM-C和MCM-D三大类。QFP(QuadFlatPackage)：四侧引脚扁平封装，表面贴装型封装，引脚通常在100以上，适合高频应用，基材方面有陶瓷、金属和塑料三种。
PV040R1K1T1NFWS
PV040R1K1T1WFR1
PV040R1K1T1NKLC
PV040R9K1T1NFWS
PV040R1K1T1NFFC
PV040R1K1T1NF
PV040R1K1T1N100
PV040R1K1T1WMR1
PV040R1K1T1NFRZ
PV040R1K1T1WMRC
PV040R1K1T1NMMK
PV040R1K1T1NMMC
PV040R1K1T1VMMC
PV040R1K1T1NFHS
PV040R1K1T1NGLC
PV040R1K1T1NHLC
PV040R1K1T1WMMC
PV040L1L1T1NFWS
PV040R1K1T1NMLC
PV040R1D1T1NGCC
PV040R1K1T1NELA
PV040R9K1T1NMMCK0188
PV046R1K1T1N001
PV046R1K1T1N100
PV046R1K1T1NFDS
PV046R1K1T1NFR1
PV046R1K1T1NFHS
PV046R1K1T1NMMC
PV046R1K1T1NMM1
PV046R1K1T1NMRC
PV046R1K1T1NFWS
PV046R1K1T1NFRC
PV046R1K1T1NFF1
PV046R1D1T1NFWS
PV046R1D3T1NFFC
PV046R1K1A1NF
PV046L1K1A1NFHS
PV046R1K1B1NFDS
PV046R1D1T1NHCC
PV046R1K1T1NFFC
PV046R1K1T1NMFC
PV046R1K1T1NMF1
PV046R9K1T1NMMC
PV046R1K1AYNMRC
PV046R1K1JHNMMC
PV046R9K1T1NFWS
PV046R1K4T1NMR1
PV046R1K4T1NFHS
PV046L1K1T1NFWS
PV046R1K1S1NFWS
PV046R1K1T1WFDS
PV046R1K1T1NMRZ
PV046R1K1T1EMMC
PV046R1K1T1WMMC
PV046R1K1T1NFFP
PV046R1K1A4NFRC
PV046R1K1T1VFDS
PV046R1K8T1NFWS
PV046R1K1T1WMM1
PV046L1K1T1NMMC
PV046R1K8T1VMMC
PV046R1K8T1NMMC
PV046R1K1T1NF
PV046R1K1AYNMRZ
PV046R1K1T1NHLC
PV046R1K1T1NMMK
PV046R1K1T1NKLC
PV046R1K1T1NMR1
PV046R1K1T1NFRZ
PV046R1K1T1WFR1
PV046R1K4T1NFR1
PV046R1K1T1WMR1
PV046R1K1T1NMRK
PV046R1K1T1WMRC
PV046R1K1T1NHCC
PV046R1K1T1VMMC
PV046R1K1T1NGLC
PV046R1L1T1NMMC
PV046R1K8T1N001
PV046R1K4T1NMMC
PV046R1K1T1NMMCX5934
PV063R1K1T1NMF1
PV063R1K1T1NMMC
PV063R1K1T1NMMK
PV063R9L1TNMPCK0
PV063R1K1A1VFPR
PV063R1K1C1NFWS
PV063R2K1T1N001
PV063R9L1T1NFWS
PV063R1K1A1NFHS
PV063R1K1T1NFFP
PV063R1K1T1NFPR
PV063R1K1T1NGLC
PV063R1K1T1N001
PV063R1K1T1N100
PV063R1K1T1NFDS
作为一个新的名词，物联网网关在未来的物联网时代将会扮演至关重要的角色。物联网网关具备广泛的接入能力、可管理能力、协议转换能力，以进行数据传输、计算、处理，同时实现感知网络与通信网络、局域互联和实现远程控制，帮助运营商充分挖掘物联网的真正潜能。物联网目前面临的挑战便是——如何集成的技术和现有的基础架构，以充分利用云连接和物联网数据管理和分析，战胜这一挑战首先要越过的难关便是目前85%尚未互联互通的传统系统。
