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A10VSO10DFR/52R-PPA14N00
A10VSO10DFR/52R-PPA14N00-SO858
A10VSO10DFR/52R-PSA14N00-SO858
A10VSO10DFR/52R-PSC64N00
A10VSO10DFR/52R-PUC64N00
A10VSO10DFR/52R-PUC64N00E
A10VSO10DFR/52R-PUC64N00E
A10VSO10DFR/52R-PUC64N00ESO857
A10VSO10DFR/52R-PUC64N00-SO857
A10VSO10DFR/52R-VUC14N00
A10VSO10DFR/52R-VUC14N00-SO420
A10VSO10DFR1/52L-PKC64N00
A10VSO10DFR1/52L-PPA14N00
A10VSO10DFR1/52L-PSC14N00
A10VSO10DFR1/52L-PSC64N00
A10VSO10DFR1/52L-PUC64N00
A10VSO10DFR1/52R-PKC64N00
A10VSO10DFR1/52R-PKC64N00E
A10VSO10DFR1/52R-PKC64N00E
A10VSO10DFR1/52R-PKC64N00-SO857
A10VSO10DFR1/52R-PKC64N00-SO858
A10VSO10DFR1/52R-PPA14N00
要实现精密或精密磨削，首先要减少磨粒单刃切除量，而使用微细或微细微粉的磨粒是减少单刃切除量的*有效途径。日本镜面磨削时使用的磨具粒度为4～8#，其微粉的均匀尺寸为1.5M～4M，加工后工件表面粗拙度可达RA.3M～.5M。使用粒径为2NM的SIO2微细微粉及锡抛光盘对蓝宝石单晶进行无损精密研磨的抛光，可获得RA《1NM的表面。目前精密量块、光学平晶、集成电路的硅基片等精密零件都是采用上述方法来获得高质量的表面。
